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Nokia NSE–3 SERIES Service Manual
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Nokia NSE–3 SERIES Service Manual

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Programs After Market Services (PAMS)
Technical Documentation
SERVICE
MANUAL
[NMP Part No.0275341]
NSE–3 SERIES
CELLULAR
PHONES
Last Update 11/97

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Summary of Contents for Nokia NSE–3 SERIES

  • Page 1 Programs After Market Services (PAMS) Technical Documentation SERVICE MANUAL [NMP Part No.0275341] NSE–3 SERIES CELLULAR PHONES Last Update 11/97...
  • Page 2 Programs After Market Services (PAMS) Technical Documentation NSE–3 SERIES DIGITAL CELLULAR PHONES SERVICE MANUAL OVERALL CONTENTS NSE–3 Series Core Transceiver booklet comprising Chapter 1: Foreword Chapter 2: General Information Chapter 3: System Module Chapter 4: UI Module Appendices to Transceiver booklet covering a specific variant Appendix 1: Transceiver NSE–3NX Booklets comprising...
  • Page 3 PAMS Technical Documentation NSE–3 SeriesTransceivers Chapter 1 Foreword Original 11/97...
  • Page 4 While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES Ltd should be notified in writing. Please state: Title of the Document + Issue Number/Date of publication...
  • Page 5 PAMS NSE–3 Foreword Technical Documentation Warnings and Cautions Please refer to the phone’s user guide for instructions relating to operation, care and maintenance including important safety information. Note also the following: Warnings: CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI–SKID BRAKING SYSTEMS.
  • Page 6 PAMS NSE–3 Foreword Technical Documentation [This page intentionally left blank] Original 11/97 Page 1 – 4...
  • Page 7 PAMS Technical Documentation NSE–3 Series Transceivers Chapter 3 System Module Original 11/97...

  • Page 8: Table Of Contents

    NSE–3 PAMS System Module Technical Documentation CONTENTS Transceiver NSE–3 ........3 –...
  • Page 9 PAMS NSE–3 System Module Technical Documentation Audio control ........3 –...
  • Page 10 NSE–3 PAMS System Module Technical Documentation Transmitter Blocks ....... . . 3 –...

  • Page 11: Transceiver Nse-3

    PAMS NSE–3 System Module Technical Documentation Transceiver NSE–3 Introduction The NSE–3 is a radio transceiver unit designed for the GSM network. It is a GSM phase 2 power class 4 transceiver providing 15 power levels with a maximum output power of 2 W. The transceiver is a true 3 V transceiver. The transceiver consists of System/RF module (UP8T), User interface module (UE4) and assembly parts.

  • Page 12: Interconnection Diagram

    NSE–3 PAMS System Module Technical Documentation Interconnection Diagram Keypad Display User Interface Module Earpiece Battery System/RF Module Antenna 3 + 3 System Charger Connector IR Link Connector Original 11/97 Page 3 – 6...

  • Page 13: System Module

    PAMS NSE–3 System Module Technical Documentation System Module External and Internal Connectors Rubber boot Microphone Solderable element, 2 pcs Contact 1 DC–jack Contact 2 Contacts Microphone port Cable/Cradle connector, 3...8 guiding/fixing hole, 3 pcs Contact 9 Page 3 – 7 Original 11/97...

  • Page 14: System Connector Contacts

    NSE–3 PAMS System Module Technical Documentation System Connector Contacts Con- Line Parameter Mini- Typical Maxi- Unit / Notes tact Sym- / Nomi- Charger input volt- V/ Unloaded ACP–9 Charger mA/ Supply current Charger input cur- 7.24 16.0 V/ Unloaded ACP–7 Charger rent mA/ Supply current DC–...

  • Page 15: Rf Connector Contacts

    PAMS NSE–3 System Module Technical Documentation RF Connector Contacts Con- Line Parameter Mini- Typical Maxi- Unit / Notes tact Symbol / Nomi- EXT_ANT External antenna connec- Im edance 50ohm tor, 0 V DC Supply Voltages and Power Consumtion Connector Line Symbol Minimum Typical / Maximum/...

  • Page 16: Baseband Module

    NSE–3 PAMS System Module Technical Documentation Baseband Module Block Diagram TX/RX SIGNALS RF SUPPLIES PA SUPPLY 13MHz SYSTEM CLOCK COBBA SUPPLY CCONT COBBA 32kHz BB SUPPLY SLEEP CLOCK VBAT MEMORIES BATTERY CHAPS AUDIOLINES BASEBAND SYSCON Technical Summary The baseband module consists of four asics, CHAPS, CCONT, COBBA– GJ and MAD2, which take care of the baseband functions of NSE–3.
  • Page 17 PAMS NSE–3 System Module Technical Documentation The interface between the baseband and the RF section is handled by a specific asic. The COBBA asic provides A/D and D/A conversion of the in–phase and quadrature receive and transmit signal paths and also A/D and D/A conversions of received and transmitted audio signals to and from the UI section.

  • Page 18: Bottom Connector External Contacts

    NSE–3 PAMS System Module Technical Documentation Bottom Connector External Contacts Contact Line Symbol Function Charger input voltage DC–jack L_GND Charger ground side contact (DC–plug ring) DC–jack Charger input voltage center pin DC–jack CHRG_CTRL Charger control output (from phone) side contact (DC–plug jacket) CHRG_CTRL Charger control output (from phone)
  • Page 19 PAMS NSE–3 System Module Technical Documentation Name Unit Notes XMIC kΩ Input AC impedance Maximum signal level 1.47 1.55 Mute (output DC level) 2.85 Unmute (output DC level) µA Bias current Maximum signal level HMIC 29.3 Microphone signal Connected to COBBA MIC3P input Ω...

  • Page 20: Battery Connector

    NSE–3 PAMS System Module Technical Documentation Battery Connector Name Unit Notes BVOLT Battery voltage Maximum voltage in call state with charger Maximum voltage in idle state with charger 2.85 Battery size indication Phone has 100kohm pull up resistor. SIM Card removal detection (Treshold is 2.4V@VBB=2.8V) kohm Battery indication resistor (Ni battery)

  • Page 21: Sim Card Connector

    PAMS NSE–3 System Module Technical Documentation SIM Card Connector Name Parameter Unit Notes Ground 3, 5 VSIM 5V SIM Card Supply voltage 3V SIM Card DATA 5V Vin/Vout ”1” VSIM SIM data ”0” Trise/Tfall max 1us 3V Vin/Vout ”1” VSIM ”0”...

  • Page 22: Rtc Backup Battery

    NSE–3 PAMS System Module Technical Documentation RTC Backup Battery The RTC block in CCONT needs a power backup to keep the clock run- ning when the phone battery is disconnected. The backup power is sup- plied from a rechargable polyacene battery that can keep the clock run- ning minimum of 10 minutes.

  • Page 23: Functional Description

    PAMS NSE–3 System Module Technical Documentation Functional Description Power Distribution In normal operation the baseband is powered from the phone‘s battery. The battery consists of one Lithium–Ion cell. There is also a possibility to use batteries consisting of three Nickel Metal Hydride cells. An external charger can be used for recharging the battery and supplying power to the phone.

  • Page 24: Battery Charging

    NSE–3 PAMS System Module Technical Documentation Battery charging The electrical specifications give the idle voltages produced by the ac- ceptable chargers at the DC connector input. The absolute maximum in- put voltage is 30V due to the transient suppressor that is protecting the charger input.

  • Page 25: Battery Overvoltage Protection

    PAMS NSE–3 System Module Technical Documentation Battery Overvoltage Protection Output overvoltage protection is used to protect phone from damage. This function is also used to define the protection cutoff voltage for differ- ent battery types (Li or Ni). The power switch is immediately turned OFF if the voltage in VOUT rises above the selected limit VLIM1 or VLIM2.

  • Page 26: Battery Removal During Charging

    NSE–3 PAMS System Module Technical Documentation Battery Removal During Charging Output overvoltage protection is also needed in case the main battery is removed when charger connected or charger is connected before the bat- tery is connected to the phone. With a charger connected, if VOUT exceeds VLIM1 (or VLIM2), CHAPS turns switch OFF until the charger input has sunken below Vpor (nominal 3.0V, maximum 3.4V).

  • Page 27: Different Pwm Frequencies ( 1Hz And 32 Hz)

    PAMS NSE–3 System Module Technical Documentation Different PWM Frequencies ( 1Hz and 32 Hz) When a travel charger (2– wire charger) is used, the power switch is turned ON and OFF by the PWM input when the PWM rate is 1Hz. When PWM is HIGH, the switch is ON and the output current Iout = charger cur- rent –...

  • Page 28: Battery Identification

    NSE–3 PAMS System Module Technical Documentation Battery Identification Different battery types are identified by a pulldown resistor inside the bat- tery pack. The BSI line inside transceiver has a 100k pullup to VBB. The MCU can identify the battery by reading the BSI line DC–voltage level with a CCONT (N100) A/D–converter.

  • Page 29: Battery Temperature

    PAMS NSE–3 System Module Technical Documentation Battery Temperature The battery temperature is measured with a NTC inside the battery pack. The BTEMP line inside transceiver has a 100k pullup to VREF. The MCU can calculate the battery temperature by reading the BTEMP line DC– voltage level with a CCONT (N100) A/D–converter.
  • Page 30 NSE–3 PAMS System Module Technical Documentation The RTC backup is rechargable polyacene battery, which has a capacity of 50uAh (@3V/2V) The battery is charged from the main battery voltage by the CHAPS when the main battery voltage is over 3.2V. The charging current is 200uA (nominal).

  • Page 31: Switched Mode Supply Vsim

    PAMS NSE–3 System Module Technical Documentation Switched Mode Supply VSIM There is a switched mode supply for SIM–interface. SIM voltage is se- lected via serial IO. The 5V SMR can be switched on independently of the SIM voltage selection, but can’t be switched off when VSIM voltage value is set to 5V.

  • Page 32: Power Up With A Charger

    NSE–3 PAMS System Module Technical Documentation Power up with a charger When the charger is connected CCONT will switch on the CCONT digital voltage as soon as the battery voltage exeeds 3.0V. The reset for CCONT’s digital parts is released when the operating voltage is stabilized ( 50 us from switching on the voltages).

  • Page 33: Power Up By Rtc

    PAMS NSE–3 System Module Technical Documentation Power Up by RTC RTC ( internal in CCONT) can power the phone up by changing RTCPwr to logical ”1”. RTCPwr is an internal signal from the CCONT digital section. Power Up by IBI IBI can power CCONT up by sending a short pulse to logical ”1”.

  • Page 34: Power Off

    NSE–3 PAMS System Module Technical Documentation dicated by a resistor inside the battery pack. The resistor value corre- sponds to a specific battery capacity. This capacity value is related to the battery technology as different capacity values are achieved by using dif- ferent battery technology.

  • Page 35: Audio Control

    PAMS NSE–3 System Module Technical Documentation Audio control The audio control and processing is taken care by the COBBA–GJ, which contains the audio and RF codecs, and the MAD2, which contains the MCU, ASIC and DSP blocks handling and processing the audio signals. A detailed audio specification can be found from document COBBA Bias +...

  • Page 36: External Audio Connections

    NSE–3 PAMS System Module Technical Documentation External Audio Connections The external audio connections are presented in figure 16. A headset can be connected directly to the system connector. The headset microphone bias is supplied from COBBA AUXOUT output and fed to microphone through XMIC line.

  • Page 37: Analog Audio Accessory Detection

    PAMS NSE–3 System Module Technical Documentation Analog Audio Accessory Detection In XEAR signal there is a 47 kW pullup in the transceiver and 6.8 kW pull–down to SGND in accessory. The XEAR is pulled down when an accessory is connected, and pulled up when disconnected. The XEAR is connected to the HookDet line (in MAD), an interrupt is given due to both connection and disconnection.

  • Page 38: Internal Audio Connections

    NSE–3 PAMS System Module Technical Documentation Internal Audio Connections The speech coding functions are performed by the DSP in the MAD2 and the coded speech blocks are transferred to the COBBA–GJ for digital to analog conversion, down link direction. In the up link direction the PCM coded speech blocks are read from the COBBA–GJ by the DSP.

  • Page 39: Alert Signal Generation

    PAMS NSE–3 System Module Technical Documentation Alert Signal Generation A buzzer is used for giving alerting tones and/or melodies as a signal of an incoming call. Also keypress and user function response beeps are generated with the buzzer. The buzzer is controlled with a BuzzerPWM output signal from the MAD.
  • Page 40 NSE–3 PAMS System Module Technical Documentation – CODER (Block encoding/decoding and A51&A52 ciphering) – AccIF(Accessory Interface) – SCU (Synthesizer Control Unit for controlling 2 separate synthesizer) – UIF (Keyboard interface, serial control interface for COBBA PCM Codec, LCD Driver and CCONT) –...
  • Page 41 PAMS NSE–3 System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State Col3 Input program- I/O line for key- mable pullup board column 3 PR0201 Ground Col2 Input program- I/O line for key- mable pullup board column 2 PR0201 Col1...
  • Page 42 NSE–3 PAMS System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State JTDO Tri– JTAG data out state Ground JTRst Input, pulldown JTAG reset pull- PD0201 down JTClk Input pulldown JTAG Clock PD0201 JTDI Input, pullup JTAG data in pullup...
  • Page 43 PAMS NSE–3 System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State MCUAd6 MCU address MEMORY IO VCC in Power 3325c10 MCUAd7 MCU address MEMORY MCUAd8 MCU address MEMORY MCUAd9 MCU address MEMORY MCUAd10 MCU address MEMORY Ground MCUAd11...
  • Page 44 NSE–3 PAMS System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State ExtMCUDa3 Output MCU data bus MEMORY ExtMCUDa4 Output MCU data bus MEMORY ExtMCUDa5 Output MCU data bus MEMORY ExtMCUDa6 Output MCU data bus MEMORY IO VCC in Power...
  • Page 45 PAMS NSE–3 System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State SCVCC Special cell Pow- RFClk VCXO Input System clock from VCTCXO RFClkGnd Input System clock reference ground input SIMCardDetX Input SIM card detec- tion SCGND Special cell...
  • Page 46 NSE–3 PAMS System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State MBUS Input, external MBUS, Flash exter- pullup clock pullup VCXOPwr CCONT VCXO regulator control SynthPwr CCONT Synthesizer reg- ulator control Core VCC in Power 3325c10 GenCCONTCSX...
  • Page 47 PAMS NSE–3 System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State PCMTxData COBBA Transmit data, IO VCC in Power 3325c10 PCMRxData COBBA Input Receive data, PCMDClk COBBA Input Transmit clock, CLKX PCMSClk COBBA Input Transmitframe sync, FSX COBBADAX...
  • Page 48 NSE–3 PAMS System Module Technical Documentation Pin Name Connected Drive Reset Note Explanation Type to/from req. State COBBADa0 COBBA COBBA data bit DSPGenOut5 DSP general purpose output, COBBA reset IO VCC in Power 3325c10 DSPGenOut4 DSP general purpose output DSPGenOut3 IR ON DSPGenOut2 DSP general...

  • Page 49: Memories

    PAMS NSE–3 System Module Technical Documentation Memories The MCU program code resides in an external flash program memory, which size is 8 Mbits (512kx16bit). The MCU work (data) memory size is 512kbits (64kx8bit). A serial EEPROM is used for storing the system and tuning parameters, user settings and selections, a scratch pad and a short code memory.

  • Page 50: Mcu Memory Map

    NSE–3 PAMS System Module Technical Documentation MCU Memory Map MAD2 supports maximum of 4GB internal and 4MB external address space. External memories use address lines MCUAd0 to MCUAd21 and 16–bit databus. The BUSC bus controller supports 8– and 16–bit access for byte, double byte, word and double word data.

  • Page 51: Infrared Transceiver Module

    PAMS NSE–3 System Module Technical Documentation Infrared Transceiver Module The module is activated with an IRON signal by the MAD, which supplies power to the module. The IR datalines are connected to the MAD acces- sory interface AccIf via FBUS. The RX and TX lines are separated from FBUS by three–state buffers, when the IR–module is switched off.

  • Page 52: Rtc Backup Battery Charging

    NSE–3 PAMS System Module Technical Documentation RTC backup battery charging CHAPS has a current limited voltage regulator for charging a backup bat- tery. The regulator derives its power from VOUT so that charging can take place without the need to connect a charger. The backup battery is only used to provide power to a real time clock when VOUT is not present so it is important that power to the charging circuitry is derived from VOUT and that the charging circuitry does not present a load to the backup battery...

  • Page 53: Ibi Accessories

    PAMS NSE–3 System Module Technical Documentation IBI Accessories All accessories which can be connected between the transceiver and the battery or which itself contain the battery, are called IBI accessories. Either the phone or the IBI accessory can turn the other on, but both pos- sibilities are not allowed in the same accessory.

  • Page 54: Rf Module

    NSE–3 PAMS System Module Technical Documentation RF Module Maximum Ratings Parameter Rating Battery voltage, idle mode 6.0 V Battery voltage during call, highest power level 5.0 V Regulated supply voltage 2.8 +/– 3% V Voltage reference 1.5 +/– 1.5% V Operating temperature range –10...+55 deg.

  • Page 55: Power Distribution Diagram

    PAMS NSE–3 System Module Technical Documentation Power Distribution Diagram Page 3 – 49 Original 11/97...

  • Page 56: Dc Characteristics

    NSE–3 PAMS System Module Technical Documentation DC Characteristics Regulators Transceiver has got a multi function power management IC, which con- tains among other functions, also 7 pcs of 2.8 V regulators. All regulators can be controlled individually with 2.8 V logic directly or through control register.
  • Page 57 PAMS NSE–3 System Module Technical Documentation UHF PLL is located into PLUSSA. There is 64/65 (P/P+1) prescaler, N– and A–divider, reference divider, phase detector and charge pump for the external loop filter. UHF local signal is generated by a VCO–module (VCO = voltage controlled oscillator ) and sample of frequency of VCO is fed to prescaler.

  • Page 58: Receiver

    NSE–3 PAMS System Module Technical Documentation Receiver Receiver is a dual conversion linear receiver. Received RF–signal from the antenna is fed via the duplex filter to LNA (low noise amplifier ) in CRFU_1a. Active parts ( RF–transistor and bias- ing and AGC–step circuitry ) are integrated into this chip. Input and output matching networks are external.

  • Page 59: Transmitter

    PAMS NSE–3 System Module Technical Documentation Transmitter Transmitter chain consists of IQ–modulator, upconversion mixer, power amplifier and there is a power control loop. I– and Q–signals are generated by baseband also in COBBA–ASIC. After post filtering ( RC–network ) they go into IQ–modulator in PLUSSA. It generates modulated TX IF–frequency, which is VHF–synthesizer output divided by two, meaning 116 MHz.
  • Page 60 NSE–3 PAMS System Module Technical Documentation This detected voltage is compared in the error–amplifier in PLUSSA to TXC–voltage, which is generated by DA–converter in COBBA. Because also gain control characteristics in PA are linear in absolute scale, control loop defines a voltage loop, when closed. Closed loop tracks the TXC– voltage quite linearilly.

  • Page 61: Agc Strategy

    PAMS NSE–3 System Module Technical Documentation AGC strategy AGC–amplifier is used to maintain output level of the receiver almost constant. AGC has to be set before each received burst, this is called pre–monitoring. Receiver is switched on roughly 150 ms before the burst begins, DSP measures received signal level and adjusts RXC, which con- trols RX AGC–amplifier or it switches off the LNA with PDATA0 control line.

  • Page 62: Afc Function

    NSE–3 PAMS System Module Technical Documentation AFC function AFC is used to lock the transceivers clock to frequency of the base sta- tion. AFC–voltage is generated in COBBA with 11 bit AD–converter. There is a RC–filter in AFC control line to reduce the noise from the con- verter.

  • Page 63: Tx Interstage Filter

    PAMS NSE–3 System Module Technical Documentation Transmitter Blocks TX interstage filter Parameter Min. Typ. Max. Unit Passband 890 – 915 Insertion loss Power amplifier MMIC Parameter Symbol Test condition Unit Operating freq. range Supply voltage Gain control range Vpc= 0.5 ... 2.2 V ( overall dynamic range) Synthesizer blocks...

  • Page 64: Uhf Vco Module

    NSE–3 PAMS System Module Technical Documentation UHF VCO module Parameter Conditions Rating Unit/ Notes Supply voltage, Vcc 2.8 +/– 0.1 Supply current, Icc Vcc = 2.8 V, < 10 Vc= 2.25 V Control voltage, Vc Vcc = 2.8 V 0.8... 3.7 Oscillation frequency Vcc = 2.8 V Vc = 0.8 V...
  • Page 65 PAMS NSE–3 System Module Technical Documentation Signal From Parameter Mini- Typi- Maxi- Unit Function name SYNP CCONT Logic high ”1” 2.85 VR3, VR4 in CCONT ON Logic low ”0” VR3,VR4 in CCONT OFF RXPW CCONT Logic high ”1” 2.85 VR2, VR5 in CCONT ON Logic low ”0”...
  • Page 66 NSE–3 PAMS System Module Technical Documentation Signal From Parameter Mini- Typi- Maxi- Unit Function name PLUSSA Logic high ”1” 2.85 Transmitter power control enable Logic low ”0” COB- PLUSSA Voltage Min 0.12 0.18 Transmitter power control Voltage Max 2.27 2.33 PLUSSA Voltage Min 0.12 0.18...

  • Page 67: Timings

    PAMS NSE–3 System Module Technical Documentation Timings Synthesizer control timing 6.9 ms ( 1.5 x 4.6 ms ( frame ) 100 us 10 us 10 us 10 us 10 us 8 us min. min. min. min. min. RXPWR SYNTHPWR 2us min SENA SDATA/ MODE...
  • Page 68 NSE–3 PAMS System Module Technical Documentation In case of long list of adjacent channels, there might be two monitoring– bursts/frame. Extra monitoring ”replaces” TX–burst. 0.5–2 sec. 20 ms 4.6 ms 6.9 ms VXOENA 150 us 150 us SYNTHPWR RXPWR SENA SDATA/ SCLK Synthesizer Timing / IDLE 2, frame can start from RX–burst...

  • Page 69: Transmitter Power Switching Timing Diagram

    PAMS NSE–3 System Module Technical Documentation Transmitter power switching timing diagram 542.8 us Pout 8.3..56.7 us 0...58 us 0...56.7 us TXPWR 150 us 50 us Synthesizer clocking Synthesizers are controlled via serial control bus, which consists of SDA- TA, SCLK and SENA1 signals. These lines form a synchronous data transfer line.

  • Page 70: Block Diagram Of Baseband Blocks

    NSE–3 PAMS System Module Technical Documentation Block Diagram of Baseband Blocks REGULATORS REGULATORS 32 kHz CHARGER CHAPS CRYSTAL N101 CCONT CHR_CONTR N100 SO16 READER VBATT SIMCARD 3...0 X302 A/D CONV. UI BOARD BACK UP SQFP64 BATTERY G100 DISPLAY X300 PwrOnX GenSIO,LCDEn,CCONTCSX 32 kHz BUZZER...

  • Page 71: Parts List Of Up8T (Edms Issue 11.10)

    PAMS NSE–3 System Module Technical Documentation Parts list of UP8T (EDMS Issue 11.11) Code: 0200951 ITEM CODE DESCRIPTION VALUE TYPE R100 1430826 Chip resistor 680 k 5 % 0.063 W 0402 R102 1430796 Chip resistor 47 k 5 % 0.063 W 0402 R103 1430770 Chip resistor 4.7 k...
  • Page 72 NSE–3 PAMS System Module Technical Documentation R307 1620031 Res network 0w06 2x1k0 j 0404 0404 R308 1430754 Chip resistor 1.0 k 5 % 0.063 W 0402 R309 1620031 Res network 0w06 2x1k0 j 0404 0404 R401 1430778 Chip resistor 10 k 5 % 0.063 W 0402 R402 1430754 Chip resistor...
  • Page 73 PAMS NSE–3 System Module Technical Documentation R636 1430848 Chip resistor 12 k 1 % 0.063 W 0402 R638 1430848 Chip resistor 12 k 1 % 0.063 W 0402 R640 1430734 Chip resistor 5 % 0.063 W 0402 R641 1820031 NTC resistor 10 % 0.12 W 0805 R660 1430726 Chip resistor...
  • Page 74 NSE–3 PAMS System Module Technical Documentation C161 2320546 Ceramic cap. 27 p 5 % 50 V 0402 C201 2320620 Ceramic cap. 10 n 5 % 16 V 0402 C202 2320620 Ceramic cap. 10 n 5 % 16 V 0402 C203 2320620 Ceramic cap.
  • Page 75 PAMS NSE–3 System Module Technical Documentation C313 2320546 Ceramic cap. 27 p 5 % 50 V 0402 C400 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805 C401 2312401 Ceramic cap. 1.0 u 10 % 10 V 0805 C402 2320544 Ceramic cap.
  • Page 76 NSE–3 PAMS System Module Technical Documentation C585 2320560 Ceramic cap. 100 p 5 % 50 V 0402 C586 2320540 Ceramic cap. 15 p 5 % 50 V 0402 C587 2310248 Ceramic cap. 4.7 n 5 % 50 V 1206 C588 2320546 Ceramic cap.
  • Page 77 PAMS NSE–3 System Module Technical Documentation L108 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603 L400 3640035 Filt z>450r/100m 0r7max 0.2a 0603 0603 L500 3643039 Chip coil 220 n 5 % Q=35/100 MHz 0805 L501 3643039 Chip coil 220 n 5 % Q=35/100 MHz 0805 L550 3640069 Filt 47pf 25v 0r01 6a 1206...
  • Page 78 NSE–3 PAMS System Module Technical Documentation N620 4370273 Plussa txmod+rxif+2pll tqfp64 TQFP64 S301 5219005 IC, SWsp–no 30vdc 50ma smSW TACT S302 5219005 IC, SWsp–no 30vdc 50ma smSW TACT X100 5469061 SM, system conn 6af+3dc+mic+jack X101 5469069 SM, batt conn 2pol spr p3.5 100v 100V2A X102 5469069 SM, batt conn 2pol spr p3.5 100v...
  • Page 79 PAMS NSE–3 System Module Technical Documentation This page intentionally left blank. Page 3 – 73 Original 11/97...
  • Page 80 PAMS Technical Documentation Chapter 4 UI Module UE4 Original 11/97...
  • Page 81 PAMS UI Module UE4 Technical Documentation CONTENTS UIF Module ..........4 –...

  • Page 82: Uif Module

    PAMS UI Module UE4 Technical Documentation UIF Module Introduction The UI module UE4 is a four layer PCB, which is connected to the sys- tem/RF PCB with a 28–pin spring connector. Page 4 – 3 Original 11/97...

  • Page 83: Baseband Block Diagram

    PAMS UI Module UE4 Technical Documentation Baseband Block Diagram Original 11/97 Page 4 – 4...

  • Page 84: The Engine Interface

    PAMS UI Module UE4 Technical Documentation The Engine Interface Pin Line Sym- Parameter Unit Notes ROW0 Keyboard matrix row 0 0.3xVBB 0.7xVBB High ROW1 Keyboard matrix row 1 0.3xVBB 0.7xVBB High ROW2 Keyboard matrix row 2 0.3xVBB 0.7xVBB High ROW3 Keyboard matrix row 3 0.3xVBB 0.7xVBB...
  • Page 85 PAMS UI Module UE4 Technical Documentation Line Sym- Parameter Unit Notes LCD driver serial data 0.3xVBB 0.7xVBB High LCDCSX LCD driver chip select 0.3xVBB Low / Active 0.7xVBB High LCDRSTX LCD driver reset 0.3xVBB Low / Active 0.7xVBB High Digital ground UDGND BUZZER Buzzer PWM control...

  • Page 86: The Lcd Module Interface

    PAMS UI Module UE4 Technical Documentation The LCD Module Interface Line Parameter Mini- Typical Maxi- Unit Notes Symbol / Nomi- Supply voltage 2.85 SCLK Serial clock input VBB = 2.7V Serial data input 0.3xVBB 0.7xVBB LCDCDX Control/display data flag input 0.3xVBB Control 0.7xVBB...

  • Page 87: Functional Description

    PAMS UI Module UE4 Technical Documentation Functional Description Power Distribution Diagram PWRXON VBATT LEDs of LEDs of Display Buzzer Display Keybord UAGND UDGND Display Circuit The display circuit includes LCD module GD40 and two capacitors. The LCD module is COG (Chip on Glass) technology. The connection method for chip on the glass is ACF, Adhesive Conductive Film.

  • Page 88: Keyboard

    PAMS UI Module UE4 Technical Documentation Keyboard Typical value for node is marked with black when circuit is not active Typical value for node is marked with gray when circuit is active Page 4 – 9 Original 11/97...

  • Page 89: Keyboard Matrix

    PAMS UI Module UE4 Technical Documentation Keyboard Matrix ROW/COL FLIP Side Key Send End/Mode Side Key Soft left Down Soft Right PWR switch NC = Not Connected S Left S Right Down Send Power Key Micro switch is used as a power key on UI module. Circuitry includes mi- switch and two diodes which is needed for MAD interface.

  • Page 90: Backlighting

    PAMS UI Module UE4 Technical Documentation Backlighting Typical value for node is marked with black when circuit is not active Typical value for node is marked with gray when circuit is active Page 4 – 11 Original 11/97...

  • Page 91: Display

    PAMS UI Module UE4 Technical Documentation Display Backlighting is provided by LEDs, three LED on right and three on left side of display. LEDs are compatible with CL270–YG and those are side illuminating. Light is on when LIGHT–signal is in HIGH state. Color of LED is for Line Parameter...

  • Page 92: Speaker

    PAMS UI Module UE4 Technical Documentation Speaker The speaker is sealed to A–cover and UI PCB with silicon gasket. With that the frequency response is more constant. Speaker needs 6pcs of 1.2mm holes under component for leaking sound pressure into RF–sec- tion through UI module and 7pcs of 0.9mm holes left corner of UIM to leak from RF–section back to up cavity of phone.
  • Page 93 PAMS UI Module UE4 Technical Documentation Parts list of UE4 (EDMS Issue 9.0) Code: 0200860 ITEM CODE DESCRIPTION VALUE TYPE R001 1430043 Chip resistor 2.2 k 5 % 0.063 W 0603 R002 1430155 Chip resistor 5 % 0.063 W 0603 R004 1430047 Chip resistor 3.3 k...
  • Page 94 PAMS UI Module UE4 Technical Documentation S001 5200120 Push button switch 6.4x5.2 smd 9850046 PCB UE4 118.0X41.5X0.8 M4 4/PA 9850046 PC board 118.0x41.5x0.8 m4 4/pa Page 4 – 15 Original 11/97...
  • Page 95 PAMS UI Module UE4 Technical Documentation This page intentionally left blank. Original 11/97 Page 4 – 16...
  • Page 96 UIF Module UE4 Circuit Diagram of UIF Module (Version 8 Edit 44) for layout version 10 Original 11/97 4/A3–1...

  • Page 97: Circuit Diagram Of Speaker And Lcd Modules For Layout Version

    UIF Module UE4 Circuit Diagram of Speaker and LCD Modules for layout version 10 Speaker (Versio 8 Edit 26) (Versio 6 Edit 19) Original 11/97 4/A3–2...
  • Page 98 UIF Module UE4 Circuit Diagram of Keyboard (Version 8 Edit 38) for layout version 10 Original 11/97 4/A3–3...

  • Page 99: Layout Diagram Of Ue4 (Version 09)

    UIF Module UE4 Layout Diagram of UE4 (Version 10) Original 11/97 4/A3–4...
  • Page 100 PAMS Technical Documentation Appendix 1 TRANSCEIVER NSE–3NX Original 08/96...
  • Page 101 PAMS NSE–3NX Foreword Technical Documentation CONTENTS Page No Introduction ............1–3 Service Manual Structure .
  • Page 102 While every endeavour has been made to ensure the accuracy of this document, some errors may exist. If any errors are found by the reader, NOKIA MOBILE PHONES should be notified in writing. Please state: Title of the Document + Issue Number/Date of publication...
  • Page 103 PAMS NSE–3NX Foreword Technical Documentation Warnings and Cautions Please refer to the phone’s user guide for instructions relating to operation, care and maintenance including important safety information. Note also the following: Warnings: CARE MUST BE TAKEN ON INSTALLATION IN VEHICLES FITTED WITH ELECTRONIC ENGINE MANAGEMENT SYSTEMS AND ANTI–SKID BRAKING SYSTEMS.
  • Page 104 PAMS Technical Documentation NSE–3 Series Transceivers Disassembly & Troubleshooting Instructions Original, 11/97...
  • Page 105 NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation CONTENTS Page No Disassembly ......... Trouble Shooting .
  • Page 106 NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Remove battery Remove dust cap Carefully remove A–cover Note snap fixings ! Remove back cover screws (4 pcs) Turn around. Remove UI module screws (2 pcs) Original, 11/97 Page 3...
  • Page 107 NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Remove UI–module and frame Remove engine module screw (1 pcs) Remove engine module Pull out antenna Remove RTC–battery Remove microphone Original, 11/97 Page 4...

  • Page 108: Trouble Shooting

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Trouble Shooting The following hints should facility finding the cause of the problem when the circuitry seems to be faulty. This trouble shooting instruction is di- vided following section. 1. Phone is totally dead 2.

  • Page 109: Phone Is Totally Dead

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Phone is totally dead This means that phone doesn’t take current at all when the power switch is pressed or when the watchdog disable pin (X001 pin 11) is grounded. Used battery voltage must be higher than 3.0 V. Otherwise the hardware of CCONT (N100) prevents totally to switch power on.
  • Page 110 NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions The fault information messages could be: – MCU doesn’t boot – Serial clock line failure – Serial data line failure – External RAM fault – Algorithm file or alias ID don’t find –...

  • Page 111: Flash Programming

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Flash Programming (1) Flash programming doesn’t work If the fault information from the prommer is: a) MCU doesn’t boot b) serial data line failure c) serial clock line failure connect: connect watchdog disable (WDDIS) line (X001 pin 11) to the ground EEPROM (D240) pin 8 (VBB) 2.8 V check J522 (VXO) 2.8 V...

  • Page 112: Flash Programming Failure (2)

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Flash Programming failure (2) Flash progrmming doesn’t work If the fault information from the prommer is: External RAM fault Check pins of SRAM (D220) Check control lines of SRAM: RAMSelX ... Flash progrmming doesn’t work If the fault information from the prommer is: Algorithm file or alias ID don’t find, ID is un- known etc.

  • Page 113: Flash Programming Failure (3)

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Flash Programming failure (3) Flash programming doesn’t work If the fault information from the prommer is: a) MCU doesn’t boot b) serial data line failure c) serial clock line failure connect: connect the shortcircuit fire from N100 pin 29 to ground (watchdog) EEPROM (D240) pin 8 (VBB) 2.8 V VBAT is correct J522 (VXO) 2.8 V...

  • Page 114: Flash Programming Failure (4)

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Flash Programming failure (4) Flash progrmming doesn’t work If the fault information from the prommer is: External RAM fault Check pins of SRAM (D220) Check control lines of SRAM: RAMSelX ... Flash progrmming doesn’t work If the fault information from the prommer is: Algorithm file or alias ID don’t find, ID is un- known etc.

  • Page 115: Power Doesn't Stay On, Or Phone Is Jammed

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Power doesn’t stay on, or phone is jammed If this kind of fault has come after flash programming, there are most probably open pins in ICs. The soldered joints of ICs: D200 (MAD2), D210 (FLASH), N100 (CCONT), D221 (SRAM) are useful to check at first.

  • Page 116: Display Information: Contact Service

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Display Information: Contact Service This fault means that software is able to run and thus the watchog of CCONT (N100) can be served. Selftest functions are run when power is switched on and software is started to excute from flash.
  • Page 117 NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation constants download init patch code initialize download initialization done MAD2 pin 91 (DSPXF) J222 search last PSW channel synchronization scan starts MAD2 pin 91 (DSPXF) J222 go SDCCH send RACH imediate assigment RACH OK MAD2 pin 91 (DSPXF) J222...

  • Page 118: Phone Register Failure

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Phone register failure Phone doesn’t register to the network phone doesn,t make a call Check Analog supply voltage VCOBBA is >2.7 V N100 at pin 7,12 ... of Cobba (N250) Check Analog reference voltage Vref is 1.5 V R270, R271 at pin 9 of Cobba (N250) Supply voltage VCP (N100 pin 32) >...

  • Page 119: Sim Card Is Out Of Order

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation SIM card is out of order The hardware of the SIM interface from MAD2 (D200) to the SIM connec- tor (X302) can be tested without SIM card. When the power is switched on and if the BSI line (X101;1) is grounded by resistor, all the used lines (VSIM, RST, CLK, DATA) rises up to 5 V four times.

  • Page 120: Sim Card Failure

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions SIM Card failure Insert SIM card fault Check Voltage level < 1.5 V R120, R122, X101 at pin 95 of D200 when C120, C160 BSI resistor is connected VSIM, DATA, RESET and CLOCK lines Check rises up to 5 V after power on at pins SIM card and SIM reader...

  • Page 121: Audio Failure (1)

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Audio failure (1) Uplink (microphone) and downlink (earphone) are broken Voltage at pin 107 of MAD2 (D200) Check is 2.8 V (without external audio de- R259, R260 vices) HOOKDET Voltage at pin 108 of MAD2 (D200) Check is 2.8 V (without external audio de- R257, R256, R261...

  • Page 122: Audio Failure (2)

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Audio failure (2) Downlink (earphone) is broken Digital PCM data at pin 52 of Cobba (N250) Check during a call D200 (MAD2) Check DC voltage at pins 5 and 6 of N250 (Cobba) N250 is 1.4 V during a call Check Analog audio signal (some ten millivolts) at pins 5 and...

  • Page 123: Charger Failure

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Charger failure Nothing happens when charger is connected Voltage level at pin 60 of CCONT (N100) Check is higher than 0.4 V when charger is con- X100, F100, L104 nected R104, R103 Check N100 Display Information: Not charging Check...

  • Page 124: Receiver Fault (1)

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Receiver Fault (1) Original, 11/97 Page 21...

  • Page 125: Receiver Fault (2)

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Receiver Fault (2) Original, 11/97 Page 22...

  • Page 126: Receiver Fault (3)

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Receiver Fault (3) Original, 11/97 Page 23...

  • Page 127: Receiver Fault

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Receiver Fault (4) COBBA Check VCOBBA–voltage from N250 pin 7,12,21,25 and 63, CCONT pin 22 ~2.8V Check VBB–voltage from N250 pin 27 and 53, ~2.8V CCONT pin 55 Check VREF–voltage from N250 pin 9, CCONT pin 13 through R253 ~1.5V Check soldered joints and...

  • Page 128: Receiver Fault

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Receiver Fault (5) UHFLO G530 VCC–pin voltage, 2.8V Check VSYN_1–line and R530 Check soldered joints G530 VC(J500) voltage at G530, N620 and components in VC–line ~2.25V (Mid CH) Change G530 Does G530 oscillate at Change G530 any frequency Check C633 and...

  • Page 129: Receiver Fault

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Receiver Fault (6) Original, 11/97 Page 26...

  • Page 130: Receiver Fault

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Receiver Fault (7) Original, 11/97 Page 27...

  • Page 131: Transmitter Fault (1)

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Transmitter Fault (1) Original, 11/97 Page 28...

  • Page 132: Transmitter Fault (2)

    NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Transmitter Fault (2) Original, 11/97 Page 29...

  • Page 133: Transmitter Fault (3)

    NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Transmitter Fault (3) Power Control TXLEV5 Transmitter Transmitter working OK Fault N250 pin 11, Check TXC – line from N250 TXC – pulse OK pin 17, if OK change N250 N620 pin 11 and 12 pulses V550 anode, Check VSYN_1 voltage are about the same...
  • Page 134 NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Appendix A Picture 1. COBBACLK – signal Picture 2. 13 MHz Main clock – signal Original, 11/97 Page 31...
  • Page 135 NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Appendix B Picture 3. SCLK – signal Picture 4. SDATA – signal Picture 5. SENA1 – signal Original, 11/97 Page 32...
  • Page 136 NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions Appendix C Picture 6. TXQP, TXQN, TXIP and TXIN – signal Picture 7. TXP – signal Picture 8. VTX – signal Original, 11/97 Page 33...
  • Page 137 NSE–3 PAMS Disassembly & Troubleshooting Instructions Technical Documentation Appendix D Picture 9. TXC – signal (TXLEV5) Picture 10. DET – signal(N620 pin 12) TXLEV5 Original, 11/97 Page 34...
  • Page 138 NSE–3 PAMS Technical Documentation Disassembly & Troubleshooting Instructions This page intentionally left blank. Original, 11/97 Page 35...
  • Page 139 PAMS Technical Documentation HFU–2 Original 11/97...
  • Page 140 PAMS HFU–2 Technical Documentation CONTENTS Introduction ..........Technical Summary .

  • Page 141: Introduction

    PAMS HFU–2 Technical Documentation Introduction The HFU–2 is a handsfree unit for DCT3 compatible handportable phones. It provides rapid charging for the phone, a possibility to use HF– operation and connections to the data–card and handset unit. The HF box can be connected directly to the Mobile holder MCC–1 via the exter- nal cable.

  • Page 142: List Of Modules

    PAMS HFU–2 Technical Documentation List of Modules Name of module Type code Material Notes code HF unit HFU–2 0694049 Advanced handsfree unit HF module 0200948 ED2 Advanced hadsfree module Assembly parts MHFU–2 0261602 Mechanical Parts Operation Phone not connected (sleep mode): When the phone is not connected the current consumption of the device has been minimized.

  • Page 143: Charging Voltage Limits Within Current Specifications Fulfilled

    PAMS HFU–2 Technical Documentation Charging voltage limits within current specifications fulfilled Conn. / pin Line Symbol Minimum Typical / Maximum Unit / Notes Nominal X200 / 7 X200 / 2 +10VA 9.50 10.0 10.55 X200 / 2 +10VA IDC / mA Conn.

  • Page 144: Hfs-12 Audio Specifications, Acoustic

    PAMS HFU–2 Technical Documentation HFS–12 Audio Specifications, acoustic Minimum Typical / Maximum Unit / Notes Nominal Electroacoustic transfer func- dBPa / 1V at system tion (RX) dBPa/1V/0.5m connector is theoreti- cal level Speaker distortion level at mVrms XEAR–SGND, d=5% HF–speaker: SPL, approxi- dB / 1W / 1m mate over 500 ...

  • Page 145: Block Diagram

    PAMS HFU–2 Technical Documentation Block Diagram protec– EXTERNAL DC connector tion I / O X300 IGNS CHARGE SMPS IGNS CHGON RESET V_IN CHRG_CTRL CONTROL POWER CIRCUITS SUPPLY MBUS PWRON MUTE AUDIO System con- protec– MICROPHONE AUDIO MUTE nector X100 tion AMPLIFIER INTERFACE LOGIC...

  • Page 146: Exploded View Of Hfu-2

    PAMS HFU–2 Technical Documentation Exploded View of HFU–2 Original 11/97 Page 8...

  • Page 147: Parts List Of Ed2 (Edms Issue )

    PAMS HFU–2 Technical Documentation Parts list of ED2 (EDMS Issue 5.1) Code: 0200948 ITEM CODE DESCRIPTION VALUE TYPE R200 1415960 Melf resistor 33.2 k 1 % 0.2 W 0204 R201 1412409 Chip resistor 1.5 k 5 % 0.1 W 0805 R202 1430051 Chip resistor 4.7 k...
  • Page 148 PAMS HFU–2 Technical Documentation R317 1430087 Chip resistor 100 k 5 % 0.063 W 0603 R319 1430079 Chip resistor 47 k 5 % 0.063 W 0603 R321 1430071 Chip resistor 22 k 5 % 0.063 W 0603 R323 1414536 Chip resistor 200 k 1 % 0.1 W 0805 R324...
  • Page 149 PAMS HFU–2 Technical Documentation R435 1430095 Chip resistor 220 k 5 % 0.063 W 0603 R436 1430159 Chip resistor 5 % 0.063 W 0603 R437 1414276 Chip resistor 47 k 1 % 0.1 W 0805 R438 1430043 Chip resistor 2.2 k 5 % 0.063 W 0603 R439 1415230 Melf resistor...
  • Page 150 PAMS HFU–2 Technical Documentation C323 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603 C326 2320107 Ceramic cap. 10 n 5 % 50 V 0603 C329 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603 C334 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603 C335...
  • Page 151 PAMS HFU–2 Technical Documentation C443 2320091 Ceramic cap. 2.2 n 5 % 50 V 0603 C444 2320043 Ceramic cap. 22 p 5 % 50 V 0603 C445 2320063 Ceramic cap. 150 p 5 % 50 V 0603 C446 2320083 Ceramic cap. 1.0 n 5 % 50 V 0603 C447...
  • Page 152 PAMS HFU–2 Technical Documentation V309 4100285 Diode x 2 BAV99 70 V 200 mA SER.SOT23 V310 4100285 Diode x 2 BAV99 70 V 200 mA SER.SOT23 V311 4210096 Transistor BCP54 npn 45 V 1.5 A SOT223 V312 4100285 Diode x 2 BAV99 70 V 200 mA SER.SOT23 V313...
  • Page 153 PAMS HFU–2 Technical Documentation [This page intentionally left blank] Page 15 Original 11/97...
  • Page 154 PAMS Technical Documentation CARK–64 Installation Guide Original 11/97...
  • Page 155 The information given is for general guidance only. The terms of warranty demand that this car kit be installed by an experi- enced installer and only genuine Nokia parts are used. An end user should never attempt to install this car kit without professional assistance as the installation requires special tools and knowledge.
  • Page 156 PAMS CARK–64 Technical Documentation Unpacking Carefully unpack the equipment and ensure that the following items are present. Phone Holder MBC–1 Swivel Mount HHS–9 Mobile Charger LCH–9 Page 3 Original 11/97...
  • Page 157 HHS–9, or the mounting plate MKU–1. The mounting must be secured with a screw (included with HHS–9). The screw recess can then be cov- ered with the NOKIA logo plate. Mounting Plate MKU–1 and Swivel Mount HHS–9 MKU–1 is a fixed position mounting plate; HHS–9 is a swivel mount which allows for adjustable fixing.
  • Page 158 PAMS CARK–64 Technical Documentation [This page intentionally left blank] Page 5 Original 11/97...
  • Page 159 PAMS Technical Documentation CARK–91 Installation Guide Original 11/97...
  • Page 160 The information given is for general guidance only. The terms of warranty demand that this car kit be installed by an experi- enced installer and only genuine Nokia parts are used. An end user should never attempt to install this car kit without professional assistance as the installation requires special tools and knowledge.
  • Page 161 PAMS CARK–91 Technical Documentation Unpacking Carefully unpack the equipment and ensure that the following items are present. Advanced Active Car Holder MCC–1 Advanced HF Unit HFU–2 Power Cable PCH–4J Mounting Plate MKU–1 Swivel Mount HHS–9 HF Microphone HFM–8 HF Speaker HFS–12 HHS–9 MKU–1...
  • Page 162 The holder is attached to the vehicle’s interior using the swivel mount HHS–9. The mounting must be secured with a screw (included with HHS–9). The screw recess can then be covered with the NOKIA logo plate. Advanced HF Unit HFU–2 The handsfree unit enables the phone to operate in handsfree mode.
  • Page 163 PAMS CARK–91 Technical Documentation Power Cable PCH–4J The power cable connects the standard handsfree unit HFU–2 to the ve- hicle’s power supply. The red wire must be connected to the + voltage on the vehicle’s power supply via the supplied fused connector. The black wire must be attached to a good negative GND connection.
  • Page 164 PAMS CARK–91 Technical Documentation Installation There are some important aspects that require special attention in posi- tioning car kit accessories. The positioning of the phone holder is the most important factor when try- ing to achieve the most comfortable position for the user. The location of the holder should be selected so that the visibility of the phone’s display is good under all lighting conditions, but not so that the driver’s attention is easily distracted.
  • Page 165 PAMS CARK–91 Technical Documentation Ignition Sense IGNS The ignition sense feature prevents your car kit from draining the car bat- tery by executing an auto power off in 20 seconds after the ignition key has been turned off. The blue wire of the power cable is used for the igni- tion sense feature.
  • Page 166 PAMS CARK–91 Technical Documentation Antenna Motor Control AMC The antenna motor control offers a feature, green wire of the system cable (AMC), that may be used to control different devices on and off. The voltage in this output is +12 V whenever the phone is on. If the phone is turned off, the voltage disappeares.
  • Page 167 PAMS CARK–91 Technical Documentation [This page intentionally left blank] Page 9 Original 11/97...

  • Page 168: Service Tools

    PAMS Technical Documentation NSE/K/B–3 Series Transceivers Service Tools Original, 11/97...
  • Page 169 NSE/K/B–3 PAMS Service Tools Technical Documentation CONTENTS Page No Battery Adapter BDC–3 ........Product Code .
  • Page 170 NSE/K/B–3 PAMS Technical Documentation Service Tools DC Cable PCC–1B ..........Product Code .

  • Page 171: Battery Adapter Bdc-3

    NSE/K/B–3 PAMS Service Tools Technical Documentation Battery Adapter BDC–3 The Battery Adapter BDC–3 is used along with an external battery capacity meter to check battery capacity. Note that Li–ion batteries have an internal protection circuit to prevent deep discharge. Product Code Battery Adapter BDC–3: 0770083 View of BDC–3...

  • Page 172: Service Battery Bbd-3

    NSE/K/B–3 PAMS Technical Documentation Service Tools Service Battery BBD–3 The Service Battery BBD–3 is used in place of the phone’s normal battery during service, to supply a controlled operating voltage to the phone for current and charger calibration, and is also required when flashing the phone.

  • Page 173: Light Module Jig Jbt-1

    NSE/K/B–3 PAMS Service Tools Technical Documentation Light Module Jig JBT–1 The Light Module Jig JBT–1 is used for component level repair of the system/RF module. * Product Code Light Module Jig JBT–1: 0770109 View of JBT–1 *) Connect the External antenna cable XRC–1B, service Cable SCH–5, and the DC Cable PCS–1 to the JBT–1 jig.

  • Page 174: Module Jig Jbs-19

    NSE/K/B–3 PAMS Technical Documentation Service Tools Module Jig JBS–19 The Module Jig JBS–19 is used for repair of both system/RF and UIF modules. * Product Code Light Module Jig JBS–19: 0770098 View of JBS–19 *) Connect the External antenna cable XRC–1B, service Cable SCH–5, and the DC Cable PCS–1 to the JBS–19 jig.

  • Page 175: Flash Loading Adapter Fla-5

    NSE/K/B–3 PAMS Service Tools Technical Documentation Flash Loading Adapter FLA–5 (Sales Pack) The Flash Loading Adapter FLA–5 is used with the Service Battery BBD–3 and Service Cable SCH–5. Power is supplied to FLA–5 from the Flash Security Box TDF–4 via the DC cable PCC–1B, (The PCC–1B cable can be replaced with a Travel Charger ACH–6), and is connected to the Flash Prommer FPS–4S with the cable AXS–5.

  • Page 176: Flash Prommer Fps-4S

    NSE/K/B–3 PAMS Technical Documentation Service Tools Flash Prommer FPS–4S (Sales Pack) The Flash Prommer FPS–4S is used to update the main software of the phone. Updating is done by first loading the new MCU software from the PC to the flash prommer, and then loading the new SW from the prommer to the phone.

  • Page 177: Security Box Tdf-4

    NSE/K/B–3 PAMS Service Tools Technical Documentation Security Box TDF–4 The Security Box TDF–4 is required for updating MCU software, and infra red testing. Note1: TDF–4 is delivered in de–activated mode. Fill in the enclosed Activation Request Form, and fax to NMP Salo to get the activation code Note2: The infra red module JLP–1 is not included in the TDF–4 sales...

  • Page 178: Service Audio Box Jba-4

    NSE/K/B–3 PAMS Technical Documentation Service Tools Service Audio Box JBA–4 The Service Audio Box JBA–4 is used between the Service Cable SCH–5, MBUS Cable DAU–9S, and Audio Cable ADS–1. Product Code Service Audio Box JBA–4: 0770094 View of JBA–4 Original, 11/97 Page 11...

  • Page 179: Service Cable Sch-5

    NSE/K/B–3 PAMS Service Tools Technical Documentation Service Cable SCH–5 The Service Cable SCH–5 is used between the phone and Service Audio Box JBA–4 (or modular T–adapter. It is also used between the phone and the Flash Loading Adapter FLA–5. Product Code Service Cable SCH–5: 0730098 View of SCH–5...

  • Page 180: Warranty Cable Sch-6

    NSE/K/B–3 PAMS Technical Documentation Service Tools Warranty Cable SCH–6 The Warranty cable SCH–6 is used to connect two phones, and enables transfer of data (stored numbers etc.) from one phone to another. Product Code Warranty Cable SCH–6: 0730099 View of SCH–6 Original, 11/97 Page 13...

  • Page 181: Audio Cable Ads-1

    NSE/K/B–3 PAMS Service Tools Technical Documentation Audio Cable ADS–1 Audio cable is an adapter routing AF signals (MIC/EAR) from 8 pin modular connector to two BNC connectors. It is used to connect JBA–4, SCH–5, and DAU–9S. Product code Audio Cable ADS–1: 0730011 View of ADS–1 Original, 11/97...

  • Page 182: D15-D15 Cable Axs-5

    NSE/K/B–3 PAMS Technical Documentation Service Tools D15–D15 Cable AXS–5 The D15–D15 Cable AXS–5 is used to connect two 15 pin D connectors. e.g. between FLA–5 and FPS–4S. Product Code D15–D15 Cable AXS–5: 0730091 View of AXS–5 Original, 11/97 Page 15...

  • Page 183: Dc Cable Pcc-1B

    NSE/K/B–3 PAMS Service Tools Technical Documentation DC Cable PCC–1B The DC Cable PCC–1B is used e.g. to connect FLA–5 and TDF–4. Product Code DC Cable PCC–1B: 0770053 View of PCC–1 Original, 11/97 Page 16...

  • Page 184: Dc Cable Scb-3

    NSE/K/B–3 PAMS Technical Documentation Service Tools DC Cable SCB–3 The DC Cable SCB–3 is used to connect the Service Battery to the charger connection Vin of the phone when doing the charger calibration service procedure. Product Code DC Cable SCB–3: 0730114 View of SCB–3 Original, 11/97...

  • Page 185: External Antenna Cable Xrc-1B

    NSE/K/B–3 PAMS Service Tools Technical Documentation External Antenna Cable XRC–1B The External Antenna Cable is used to connect the transceiver to measuring equipment during servicing. Note: Typical attenuation at 900 MHz is 0.7 dB. Typical attenuation at 1800 MHz is 0.9 dB. Product Code External Antenna Cable XRC–1B: 0730128...

  • Page 186: Light Flash Cable Flc-5

    NSE/K/B–3 PAMS Technical Documentation Service Tools Light Flash Cable FLC–5 (Not used in GSM / PCN phones) Product Code Light Flash Cable FLC–5: 0081263 View of FLC–5 Original, 11/97 Page 19...

  • Page 187: Mbus Cable Dau-9S

    NSE/K/B–3 PAMS Service Tools Technical Documentation MBUS Cable DAU–9S The MBUS Cable DAU–9S has a modular connector, and is used with the service Audio Box JBA–4, or a modular T–adapter. Product Code MBUS Cable DAU–9S: 0730108 View of DAU–9S Original, 11/97 Page 20...

  • Page 188: Mbus Cable Dau-9P

    NSE/K/B–3 PAMS Technical Documentation Service Tools MBUS Cable DAU–9P The MBUS Cable DAU–9P has a phone system connector, and is used between the phone and external devices. Product Code MBUS Cable DAU–9P: 0730109 View of DAU–9P Original, 11/97 Page 21...

  • Page 189: Power Cable Pcs-1

    NSE/K/B–3 PAMS Service Tools Technical Documentation Power Cable PCS–1 The Power Cable PCS–1 is used to connect the module jigs JBT–1 and JBS–19 to an external power supply. Product Code Power Cable PCS–1: 0730012 View of PCS–1 Original, 11/97 Page 22...

  • Page 190: T-Modular Adapter

    NSE/K/B–3 PAMS Technical Documentation Service Tools Modular T–adapter The modular T–adapter is a suitable branching unit to provide the needed parallel modular connections. Product Code Modular T–adapter: 4626134 View of Modular T–adapter Original, 11/97 Page 23...

  • Page 191: Sw Security Device Pkd-1

    NSE/K/B–3 PAMS Service Tools Technical Documentation SW Security Device PKD–1 SW security device is a piece of hardware enabling the use of the service software when connected to the parallel (LPT) port of the PC. Whitout the dongle present it is not possible to use the service software. Printer or any such device can be connected to the PC through the dongle if needed.
  • Page 192 NSE/K/B–3 PAMS Technical Documentation Service Tools This page intentionally left blank. Original, 11/97 Page 25...
  • Page 193 System Module UP8T NSE–3 Block Diagram of System/RF Blocks Original 11/97 3/A3–1...
  • Page 194 System Module UP8T NSE–3 Circuit Diagram of Baseband (Version 12 Edit 8) for layout version 14 Original 11/97 3/A3–2...
  • Page 195 System Module UP8T NSE–3 Circuit Diagram of Power Supply (Version 14 Edit 41) for layout version 14 Original 11/97 3/A3–3...
  • Page 196 System Module UP8T NSE–3 Circuit Diagram of SIM Connectors (Version 14 Edit 9) for layout version 14 Original 11/97 3/A3–4...
  • Page 197 System Module UP8T NSE–3 Circuit Diagram of CPU Block (Version 14 Edit 23) for layout version 14 NSE–3 (NSE–1) Original 11/97 3/A3–5...
  • Page 198 System Module UP8T NSE–3 Circuit Diagram of Audio (Version 14 Edit 27) for layout version 14 Original 11/97 3/A3–6...
  • Page 199 System Module UP8T NSE–3 Circuit Diagram of IR Module (Version 14 Edit 21) for layout version 14 Original 11/97 3/A3–7...
  • Page 200 System Module UP8T NSE–3 Circuit Diagram of RF Block (Version 14 Edit 26) for layout version 14 Original 11/97 3/A3–8...
  • Page 201 System Module UP8T NSE–3 Layout Diagram of UPT8T – Top (Version 14) testpoint name condition dc–level ac–level testpoint name condition dc–level ac–level J102 FBUS_RX power on pulsed DC (0V/2.8V) J502 Power control op.amp power level depended output voltage to N550 pulsed DC J103 MBUS...
  • Page 202 System Module UP8T NSE–3 Layout Diagram of UPT8T – Bottom (Version 14) testpoint name condition dc–level ac–level testpoint name condition dc–level ac–level J101 FBUS_TX active state pulsed DC (0V72.8V) J500 Control voltage for UHF channel 60 2.25 +/– 0.25 V VCO module G600 channel 1 >...
  • Page 203 PAMS Technical Documentation NSE–3 Series Transceivers Tuning Instructions Original 11/97...
  • Page 204 PAMS NSE–3 Tuning Instructions Technical Documentation CONTENTS Tuning Instructions ........General .

  • Page 205: Tuning Instructions

    PAMS NSE–3 Tuning Instructions Technical Documentation Tuning Instructions General All tuning operations of the NSE–3 are carried out using the service soft- ware. The service software turns the phone into the locals mode, in which the phone can be outwardly controlled via the MBUS interface. Tuning is based on the software communicating with the D/A and A/D converters of the phone.

  • Page 206: Required Equipment

    PAMS NSE–3 Tuning Instructions Technical Documentation Required Equipment – PC/AT computer with service software; see separate section for instructions on installation and use. – Service accessories; see equipment setup pictures. – Multimeter or DVM. – GSM radio telephone test station or separate measuring equipment as follows: –...

  • Page 207: Equipment Setup For Tuning A Phone Without Removing Covers

    PAMS NSE–3 Tuning Instructions Technical Documentation Equipment Setup for Tuning a Phone without Removing Covers Item: Service accessory: Product code: Service Battery BBD–3 0775071 DC Cable SCB–3 0730114 Service MBUS Cable DAU–9P 0730109 Software protection key PKD–1 0750018 Service SW diskette 3.5” 0774080 Page 5 Original 11/97...
  • Page 208 PAMS NSE–3 Tuning Instructions Technical Documentation Flash Concept for NSE–3 Item: Service accessory: Product code: Flash Loading Adapter FLA–5 0080178 Flash Security Box TDF–4 0770106 Prommer FPS–4S 0085095 Service Battery BBD–3 0775071 Service Cable SCH–5 0730098 DC Cable PCC–1B 0730053 D15 –...

  • Page 209: Tuning With Covers Off - Using Test-Frame Jbs-19

    PAMS NSE–3 Tuning Instructions Technical Documentation Tuning With Covers Off – Using Test–frame JBS–19 Item: Service accessory: Product code: Module Jig JBS–19 * 0770098 Service Audio Box JBA–4 ** 0770094 DC Cable PCS–1 0730012 External Antenna Cable XRC–1B 0730128 Service Cable SCH–5 ** 0730098 Service MBUS Cable DAU–9S ** 0730108...

  • Page 210: Tuning With Covers Off - Using Light Jig Jbt-1

    PAMS NSE–3 Tuning Instructions Technical Documentation Tuning With Covers Off – using Light Jig JBT–1 Item: Service accessory: Product code: Light Module Jig JBT–1 * 0770109 Service Audio Box JBA–4 ** 0770094 DC Cable PCS–1 0730012 External Antenna Cable XRC–1B 0730128 Service Cable SCH–5 ** 0730098...

  • Page 211: Warranty Transfer

    PAMS NSE–3 Tuning Instructions Technical Documentation Warranty Transfer Item: Service accessory: Product code: Warranty Cable SCH–6 0730099 Page 9 Original 11/97...

  • Page 212: Tuning Steps

    PAMS NSE–3 Tuning Instructions Technical Documentation Tuning Steps 1. RX Calibration (AGC + AFC) Reference values for the received signal strength meter are program tuned. RSSI reference signal level programming: – Select Tuning –> RX Calibration – Connect RF generator to antenna connector at 947.067710 MHz. –...

  • Page 213: I/Q Modulator Amplitude Balance And Phase Shift Tuning

    PAMS NSE–3 Tuning Instructions Technical Documentation 2. I/Q Modulator Amplitude Balance and Phase Shift Tuning The purpose of this tuning operation is to adjust the I/Q modulator d.c. off- sets and the I/Q modulator amplitude balance and phase shift. I/Q modulator d.c. offsets, amplitude balance and phase shift tuning: –...
  • Page 214 PAMS NSE–3 Tuning Instructions Technical Documentation – Use the ”Amplitude Difference” option. – Adjust the level of signal CHF+67.7 kHz (902.06777 MHz) to minimum by varying D/A converter value with <– and –> keys. – The amplitude difference between CHF+67.7 kHz and CHF–67 kHz should be >35 dB.

  • Page 215: Tuning Of Transmitter Power Levels

    PAMS NSE–3 Tuning Instructions Technical Documentation 3. Tuning of Transmitter Power Levels This adjustment loads the power levels of the phone transmitter into the EEPROM. When doing this, a pulse power meter or spectrum analyzer must be used. Power levels programming: –...
  • Page 216 PAMS NSE–3 Tuning Instructions Technical Documentation 4. Energy Management Calibration – Select Tuning –> Energy Management Calibration – Connect service battery to phone and dc cable between phone and service battery – Set supply voltage to 10.5 V – Run calibrations separately or all at once –...
  • Page 217 PAMS NSE–3 Tuning Instructions Technical Documentation This page intentionally left blank. Page 15 Original 11/97...

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